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Publications

Watch out for future
Publications of ATHENIS_3D project!

Publications:

Saponara, S., Fanucci, L., Biagi, E., Serventi, R. "Hard macrocells for DC/DC converter in automotive embedded mechatronic systems"; EURASIP Journal on Embedded Systems doi vol. 2017, n. 1; EURASIP; EU; Read more

Saponara, S., et al.: "Electrical and Electromagnetic Measurements of an Inductorless DC/DC Converter"; IEEE I2MTC 2017; SPIE Microtechnologies 2017

Saponara, S., et al.: "Universal and inductorless DC/DC converter for multi-output power supplies in sensor and actuator networks"; Paper 10246-39; 2017

Saponara, S., et al.: "Failure analysis of plastic packages for low-power ICs"; Lecture Notes in Electrical Engineering, 2017

Sisto, A., Saponara, S., Ciarpi, G., Iacopetti, F., Fanucci, L.: "Testing of DC/DC Converters for 48 V Electric Vehicles"; APPLEPIES2016 conference, 15-16 September 2016; APPLications In Electronics Pervading Industry Environment and Society; Springer, Lecture Notes in Electrical Engineering; Rome 2016; Read more

Saponara, S., Ciarpi, G., Mattaliano, C., Fanucci, L., Groza, V.: "Improving Electromagnetic Compatibility of Integrated Switching Converters for Hybrid/electric Vehicles"; IEEE EPEC 2016

Saponara S., Tisserand, P., Chassard, P., My-Ton, D.: "DC/DC converter integrated architecture for 48V supplies in micro/mild hybrid vehicle electrical engine control module"; IEEE 16th International Conference on Environment and Electrical Engineering (EEEIC)

Saponara, S., Fanucci, L., Mattaliano, C., Ciarpi, G., Sisto, A., Neri, B.: "48 V DC/DC switched-cap converter for hybrid/electric vehicles"; GE 2016, Brescia, 22-24 June 2016. Read more

A. Wright, F. Krach, N. Thielen, S. Grünler, T. Erlbacher, P. Pichler: "Simulating Wafer Bow for Integrated Capacitors Using a Multiscale Approach"; 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems; 18-20 April 2016, Thermal, Mechanical and Multi-Physics Simulation and Experiements (EuroSimE) 2016  Annual conference; IEEE EuroSiME; France, Montpellier

Grünler Saeideh; Rattmann Gudrun; Erlbacher Tobias; Bauer Anton; Florian Krach; Frey Lothar: "Towards Highly Integrated, Automotive Power SoCs Using 3D TSV-based Capacitors Operating at 100 V"; 9th International Conference on Integrated Power Electornic Systems (CIPS) 2016;

S. Tyaginov: "On the Importance of Electron-electron Scattering for Hot-carrier degradation", The Japan Society of Applied Physics, IOP Publishing, 2015

S. Tyaginov: "On the Temperature Behavior of Hot-Carrier Degradation"; IEEE International Reliability Workshop (IIRW), 2015

M. Jech; "On the Limits of Applicability of Drift-Diffusion based Hot-Carrier Degradation Modeling"; Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials (SSDM), 2015, Annual conference The Japan Society of Applied Physics, Japan 2015;

P.Sharma, "A Model for Hot-Carrier Degradation in nLDMOS Transistors Based on the Exact Solution of the Boltzmann Transport Equation Versus the Drift-Diffusion Scheme"; Proceedings of 2015 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, EUROSOI ULIS Annual conference IEEE, Bologna;

P. Sharma; "Predictive and Efficient Modeling of Hot-Carrier Degradation in nLDMOS Devices"; Proceedings of the 2015 IEEE 27th International Symposium on Power Semiconductor Devices & ICs (ISPSD); Annual Conference IEEE, Hong Kong, 2015

P. Sharma, "Modeling of Hot-Carrier Degradation in LDMOS Devices Using a Drift-Diffusion Based Approach" Proceedings of the 20th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Annual conference, IEEE, USA, 2015

P. Sharma, "Comparison of Analytic Distribution Function Models for Hot-Carrier Degradation in nLDMOSFETs"; Microelectronics Reliability v. 55(2015), issues 9-10, Elsevier USA, 2015

P. Sharma "Modeling of Hot-Carrier Degradation in nLDMOS Devices: Different Approaches to the Solution of the Boltzmann Transport Equation"; IEEE Transactions on Electron Devices v. 62 (2015), issue 6; IEEE USA, 2015

C. Zambelli "Automated characterization of TAS-MRAM test arrays"; Proc. of 2015 DTIS Conference, Annual conference IEEE, USA 2015

C. Zambelli "Reliability and Cell-to-Cell Variability of TAS-MRAM arrays under cycling conditions"; Proc. of 2015 NVMTS Conference Annual conference, IEEE, USA 2015

Grünler Saeideh; Rattmann Gudrun; Erlbacher Tobias; Bauer Anton; Frey Lothar: "High-voltage monolithic 3D capacitors based on through-silicon-via technology"; International Interconnect Technology Conference (IITC/MAM); Annual conference IEEE ITTC/MAM, USA 18.-21.05.2015, Read more

E.Wachmann, Sergio Saponara: "ATHENIS_3D: Automotive Tested High-voltage and Embedded Non-volatile Integrated SoC platform with 3D Technology"; DATE Annual Conference, IEEE DATE, GERMANY

S. Gruenler, G. Rattmann, T. Erlbacher, A.J. Bauer, and L. Frey, “Monolithic 3D TSV-based High-Voltage, High-Temperature Capacitors”
Poster presentation at the IITC-MAM Conference, Grenoble, 18-21 May 2015. A paper has been submittet to the Journal of Microelectronic Engineering (Elsevier).

S. Gruenler, G. Rattmann, T. Erlbacher, A.J. Bauer, F. Krach, and L. Frey, “Towards Highly Integrated, Automotive Power SoCs Using Capacitors Operating at 100 V implemented in TSV”.
An oral presentation has been given to the International Conference on Integrated Power Electronic Systems (CIPS 2016), Nürnberg, 8-10 March 2016. A paper has been submitted to the IEEE-CIPS 2016.

M. Bina, S. E. Tyaginov, J. Franco, K. Rupp, Y. Wimmer, D. Osintsev, B. Kaczer, T. Grasser: "Predictive Hot-Carrier Modeling of n-Channel MOSFETs", IEEE Transactions on Electron Devices, 61 (2014), 3103 - 3110. Read more.

S. E. Tyaginov, M. Bina, J. Franco, D. Osintsev, O. Triebl, B. Kaczer, T. Grasser: "Physical Modeling of Hot-Carrier Degradation for Short- and Long-channel MOSFETs"; Poster: International Reliability Physics Symposium (IRPS), Waikoloa, Hawaii, USA; XT16.1 - XT16.8. Read more.

S. Tyaginov, M. Bina, J. Franco, Y. Wimmer, F. Rudolf, H. Enichlmair, J.-M. Park, B. Kaczer, T. Grasser: "Dominant Mechanisms of Hot-Carrier Degradation in Short- and Long-Channel Transistors". Talk: International Integrated reliability Workshop (IIRW) South Lake Tahoe, USA; accepted.

Y. Wimmer, S. Tyaginov, F. Rudolf, K. Rupp, M. Bina, H. Enichlmair, J.-M. Park, R. Minixhofer, T. Grasser: "Physical Modeling of Hot-Carrier Degradation in nLDMOS Transistors" Talk: International Integrated reliability Workshop (IIRW) South Lake Tahoe, USA; accepted.

S. Tyaginov, et al: "Modeling of Hot-Carrier Degradation Based on Thorough Carrier Transport Treatment". Read more.  

S. Tyaginov, et al: "A Predictive Physical Model for Hot-Carrier Degradation in Ultra-Scaled MOSFETs", Proc.  International Conference on  Simulation of Semiconductor Processes and Devices (SISPAD) 2014, Read more.

S. Tyaginov, et al: "On the Importance of Electron-electron Scattering for Hot-carrier Degradation", Extended Abstracts of the 2014 International Conference on Solid State Devices and Materials (SSDM), 2014

S. Tyaginov, et al: "Physical Modeling of Hot-Carrier Degradation in nLDMOS Transistors", IEEE International Reliability Workshop (IIRW), 2014

S. Tyaginov, et al: "Dominant Mechanisms of Hot-Carrier Degradation in Short- and Long-Channel Transistors", IEEE International Reliability Workshop (IIRW), 2014

S. Tyaginov, et al: "Physics-Based Modeling of Hot-Carrier Degradation", In book: “Hot Carrier Degradation in Semiconductor Devices”, Editor: Tibor Grasser, Springer Science + Business Media, New York, 2014, 105-150, Read more.  

ATHENIS 3D project at the European Nanoelectronics Forum in Cannes, France

ATHENIS 3D project was presented at the European Nanoelectronics Forum in Cannes, 26th-27th November 2014 by Martin Schrems, ams AG

ATHENIS 3D project at 5th Electronics System-Integration Technology Conference in Helsinki, Finland

Presentation about ATHENIS_3D at the 5th Electronics System-Integration Technology Conference in Helsinki, Finland at 17th September 2014 during the Round table discussion on Smart System Integration in Automotive done by Ewald Wachmann, ams AG.

ATHENIS 3D project at "Long researchers night"

ATHENIS 3D project was presented to the large public on 4th April 2014 at the “Lange Nacht der Forschung” (long researchers night). In that night over 1000 people visited ams facilities. In total the Event had 136.500 visiters: www.langenachtderforschung.at

Tyaginov, S. "Tutorial on Hot-Carrier Degradation"; Infineon - Munich, Germany, 2015

Ewald Wachmann, ams AG; "ATHENIS_3D: Demonstrating new 3D integration concept"; Poster presentation, EEVC, Belgium, 2015

Innovation Award' Competition; Ewald Wachmann, ams AG; "ATHENIS_3D: Project Presentation"; ENF, 2015, Read more

Yu. Illarionov, M. I. Vexler, M. Karner, S. E. Tyaginov, J. Cervenka, T. Grasser, "TCAD Simulation of Tunneling Leakage Current in CaF2/Si(111) MIS Structures"; Current Applied Physics; Elsevier, USA 2015

Yu. Illarionov, M. Bina, S. E. Tyaginov, K. Rott, B. Kaczer, H. Reisinger, T. Grasser;  "Extraction of the Lateral Position of Border Traps in Nanoscale MOSFET";  IEEE Transactions on Electron Devices; IEEE, USA 2015

S. E. Tyaginov, M. Jech, J. Franco, P. Sharma, B. Kaczer, T. Grasser;  "Understanding and Modeling the Temperature Behavior of Hot-Carrier Degradation in SiON n-MOSFETs"; 94. IEEE Electron Device Letters, IEEE; USA 2016

S. Tyaginov, A. Makarov, M. Jech, J. Franco, P. Sharma, B. Kaczer, T. Grasser; "On the Effect of Interface Traps on the Carrier Distribution Function During Hot-Carrier Degradation"; Proc. International Integrated Reliability Workshop (IIRW-2016); USA

A. Wright, F. Krach, N. Thielen, S. Grünler, T. Erlbacher, P. Pichler; "Simulating Wafer Bow for Integrated Capacitors Using a Multiscale Approach, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems"; Poster presentation; EuroSimE 2016, Montpellier

S. Saponara et al.; Workshop presentation "48 V DC/DC switched-cap converter for hybrid/electric vehicles"; GE 2016, Brescia, Italy 22-24 June 2016

P. Sharma, S. Tyaginov, S.E. Rauch, J. Franco, B. Kaczer, A. Makarov, M.I. Vexler, T. Grasser; "A drift-diffusion-based analytic description of the energy distribution function for hot-carrier degradation in decananometer nMOSFETs;         Proc. 46th European Solid-State Device Research Conference (ESSDERC-2016); SWISS 2016

S. Saponara;  Summer School; "Athenis 3D presentation"; Summer school Enabling Technologies for IoT; Pisa, Italy

Saponara S., Tisserand, P., Chassard, P., My-Ton, D.  "Design and Measurement of Integrated Converters for Belt-driven Starter generator in 48 V Micro/mild Hybrid Vehicles"; IEEE Transactions on Industry Applications; USA 2017

S. Saponara, G. Ciarpi, V. Groza; "Design and Experimental Measurement of EMI Reduction Techniques for Integrated Switching DC/DC Converters"; IEEE Canadian Journal of Electrical and Computer Engineering; USA 2017

P. Sharma, S. Tyaginov, S.E. Rauch, J. Franco, B. Kaczer, A. Makarov, M.I. Vexler, T. Grasser; "Hot-Carrier Degradation Modeling of Decananometer nMOSFETs Using the Drift-Diffusion Approach"; IEEE Electron Device Letters; IEEE, USA, 2017

B. Ullmann, M. Jech, S. Tyaginov, M. Waltl, Y. Illarionov, A. Grill, K. Puschkarsk, H. Reisinger, T. Grasser;  "The Impact of Mixed Negative Bias Temperature Instability and Hot Carrier Stress on Single Oxide Defects"; Proc. International Reliability Physics Symposium (IRPS-2017), IEEE, USA 2017

Saponara, S., Ciarpi, G; "IC design and measurement of an inductorless 48V DC/DC converter in low-cost CMOS technology facing harsh environments"; IEEE Transactions on Circuits and Systems I; IEEE, USA, 2017

Saponara, S., Ciarpi, G.; "Universal and inductorless DC/DC converter for multi-output power supplies in sensor and actuator networks"; SPIE Microtechnologies, USA, 2017

Pieri, F., Zambelli, C., Nannini, A., Olivo, P., Saponara, S.; "Limits of sensing and storage electronic components for high-reliable and safety-critical automotive applications"; IEEE/AEIT Automotive 2017, IEEE; USA, June 2017

A. Plihon, M. Assous, R. Franiatte, D. Mermin, C. Barret, J. Charbonnier, C. Hartler, J.Siegert;  Minapad Oral presentation 2017 Conference in Grenoble entitled “Comparison of low pitch screen printed SAC bumps versus ECD manufacturing techniques for power 3D integrated flip chip devices”, Minapad 2017, Grenoble, France

S. Saponara;  Workshop; "Presentation of WP5 (lead UNIPI, ref. S. Saponara) athenis3D achievements";  AEIT/IEEE Automotive 2017; Torino, Italy

K. Revenberg;  "Electronics & Applications 2017, Tomorrows Electronics conference"; MEMS Devices, Application Based Testing; 31 May 2017        Utrecht, The Netherlands

 

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karin.ronijak(_AT_)ams.com

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