Seventh Framework

News & Events

Watch out for interesting emerging
News & Events which are related to the ATHENIS_3D topic!

See the latest movie of the ATHENIS_3D project:


Abstract submitted for workshop & presentation at Minapad 2017 Conference in Grenoble entitled "“Comparison of low pitch screen printed SAC bumps versus ECD manufacturing techniques for power 3D integrated flip chip devices”. 17th - 18th May, 2017 Grenoble. More information:


ATHENIS 3D presented at EuroSimE conference

Simulating wafer bow for integrating capacitors using a multiscsale approach was presented at EuroSimE conference on 17th-20th April, 2016 in Montepellier (France): More information:

ATHENIS 3D paper at the 16th DATE conference

New 3D stacking samples have been presented in a paper at the DATE conference on 14th-18th March 2016 in Dresden (Germany). More information: 

ATHENIS 3D project at CIPS2016

ATHENIS 3D project partner Fraunhofer presented ATHENIS 3D at the CIPS2016. The paper "Towards Highly Integrated, Automotive Power SoCs Using 3D TSV-based Capacitors Operating at 100 V" has been accepted. More information:


ATHENIS 3D project at 27th IEEE International Symposium ISPSD

Results of TSV-capacitors submitted for the 27th IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD)
More information:

ATHENIS 3D project at EEVC 2015

ATHENIS 3D poster Demonstrating new 3D integration concepts has been presented at the European Battery, Hybrid and Fuel Cell Congress on 1st-4th December 2015 in Brussels.

ATHENIS_3D: Project Presentation for the Innovation Award' Competition at the European Nanoelectronics Forum 2015 in Berlin.

Tutorial presentation on Hot-Carrier Degradation by S. Tyaginov, 7-8. Dec, 2015 in Munich

ams launches world’s smallest ambient light sensor for next generation thinner wearable products

ams introduced the TSL2584TSV, an ambient light sensor (ALS) in a through-silicon via (TSV) package which has a footprint of just 1.145 x 1.66 mm and a height of 0.32 mm. More information:


ATHENIS 3D project at the IEEE, 18th-21st May2015, Grenoble

A Poster Presentation at the IEEE 2015: "“Fabrication and Characterization of High-Voltage Monolithic 3D Capacitors based on Through-Silicon-Via Technology” at the joint 2015 IEEE International Interconnect Technology Conference and 2015 European Workshop on Materials for Advanced Metallization (May 18-21 at the Minatec Campus Conference Center in Grenoble, France) by Tobias Erlbacher (Fraunhofer Gesellschaft). More information:


ATHENIS 3D project at the ESTC, 16th-18th September 2014 in Helsinki

ATHENIS 3D was presented at the ESTC, Electronics System-Integration Technology Conference in the Session: Smart System Integration in Automotive
16 - 18. September 2014, Helsinki by Ewald Wachmann (ams AG):


ATHENIS 3D project at the European Nanoelectronics Forum in Cannes, France

ATHENIS 3D project was presented at the European Nanoelectronics Forum in Cannes, 26th-27th November 2014 by Martin Schrems, ams AG


New research results obtained within ATHENIS_3D for modeling of HV transistor reliability has been presented at the International Integrated Reliability Workshop (IIRW), South Lake Tahoe October 12-16, 2014, More Information:


ATHENIS_3D project has been presented at ESTC, Helsinki

An overview presentation about ATHENIS_3D was shown by Ewald Wachmann at the 5th Electronics System-Integration Technology Conference on September 17, Helsinki, Finland during the Round table discussion on Smart System Integration in Automotive. More Information:


ATHENIS 3D project at "Long researchers night"

ATHENIS 3D project was presented to the large public on 4th April 2014 at the “Lange Nacht der Forschung” (long researchers night). In that night over 1000 people visited ams facilities. In total the Event had 136.500 visiters:


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