cloud
Seventh Framework
eu

Impact

ATHENIS_3D will strengthen the EU leadership in automotive electronics by developing and providing the industry’s first 3D/TSV/WLP automotive IC platform. Cost savings from integration and a 5x reduction of PCB area will be shown.

The FP7 funded project ATHENIS_3D provides the industry’s first 3D integration of advanced More than Moore devices and More Moore devices (90nm and 14nm CMOS) with Through Silicon Vias (TSV) and Wafer Level Packaging (WLP) for harshest automotive conditions including temperatures up to 200C and voltages up to 200V. 

Any questions?
Please contact 

karin.ronijak(_AT_)ams.com

Platzhalter

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